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AS ONE IC Binder, 7-104-01
by AS ONE
Features |
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Brand Name : | AS ONE |
Type of Product : | IC Binder |
Part No : | 7-104-01 |
Country of Origin : | Japan |
Monotaro ID : | 33182195 |
Dimension (mm) : | 217×320×3 mm |
More Details |
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Warranty
As per AS ONE's policy -
100% Original
Products -
Free Shipping
on orders above Rs. 1,000 -
Secure
Payments -
100% buyer
Protection -
EARN
IB Coins -
Non-Returnable
As One 7-104-01 IC binder typically refers to a type of binding agent or adhesive used in the context of integrated circuits (ICs) and electronics assembly. IC binders are specialized materials designed to securely bond or attach IC components, semiconductor devices, and other electronic components to printed circuit boards (PCBs) or substrates. Here are key details about IC binders: Purpose: Component Attachment: The primary purpose of IC binders is to securely attach IC chips, surface-mount devices (SMDs), or other electronic components to a PCB or substrate during the assembly process. Types: Solder Paste: Solder paste is a common type of IC binder used in electronics assembly. It consists of solder alloy particles suspended in a flux medium. When heated during the reflow soldering process, solder paste bonds IC components to the PCB. Adhesive Binders: Adhesive binders are used to attach components that cannot be soldered or require additional mechanical support. They provide strong and durable bonds between components and the substrate. Underfill Material: Underfill materials are used to encapsulate and reinforce solder joints, particularly in ball grid array (BGA) packages. They enhance the reliability of IC connections by reducing mechanical stress and preventing thermal cycling damage. Characteristics: Thermal Conductivity: Some IC binders may have specific thermal properties to enhance or dissipate heat from the IC components. This is important in applications where thermal management is critical. Electrical Insulation: IC binders are often formulated to be electrically insulating to prevent short circuits and ensure the integrity of electronic circuits. Curing Process: Adhesive binders may require a curing or hardening process, which can involve heat, UV light, or chemical reactions, depending on the binder's composition. Adhesion Strength: The adhesion strength of IC binders is tailored to the specific requirements of the application, ensuring components remain securely attached under various conditions.
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3,599
(GST inclusive price)
3,050
(GST extra)
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